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Fractography of Ceramics and Glasses

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TOC

1. Introduction
2. Resources

3. Tools and Equipment
3.1 Low Power Optical Examination and Component Fracture Documentation
3.2 Photographing the Overall Component
3.3 Stereo Binocular Microscope
3.4 Stereoptical Microscope Camera Port
3.5 Discussion Stereomicroscope
3.6 Illumination Sources
3.7 Coatings
3.8 Size Measurements
3.9 Compound Optical Microscope
3.10 Compound Microscope with Digital Camera and Image Z-axis Scanning
3.11 Digital Image Processing and Reconstruction
3.12 Replication Equipment
3.13 Scanning Electron Microscope
3.14 Stereo SEM Imaging
3.15 Field Emission SEM
3.16 Environmental SEM
3.17 Transmission Electron Microscope
3.18 Atomic Force Microscope (AFM)
3.19 Optical Profilometer
3.20 Confocal Scanning Light Microscope
3.21 Stress Wave and Ultrasonic Fractography
3.22 High Speed Photography
3.23 X-ray Topography
3.24 Dye Penetration and Staining
3.25 Other Equipment
3.26 Other Resources
3.27 The Future

4. General examination and fracture patterns
4.1 Specimen Reconstruction
4.2 Crack Branching Patterns
4.3 Crack Branching Angles
4.4 Crack Branching Distances
4.5 Fragmentation Patterns
4.6 Laboratory Strength Test Fracture Patterns
4.6.1 Tension strength
4.6.2 Flexural strength
4.6.3 Biaxial flexural strength
4.6.4 Laboratory test specimen analysis: additional tips
4.7 Component Fracture Patterns – General
4.8 T Intersections and Crossing Cracks
4.9 Invisible cracks
4.10 Plates and Windows
4.11 Tempered Windows
4.12 Thermally Induced Plate and Window Fractures
4.13 Bottles and Pressure Vessels
4.14 Torsional Fractures
4.15 Chipping
4.16 Laboratory Test Fractures and Component Fractures
4.17 Controlled Component Fractures
4.18 Finite Element Analysis
4.19 Characteristics of Some Common Fracture Modes
4.19.1 Mechanical overload fracture
4.19.2 Thermal fracture
4.19.3 Impact or contact fractures
4.19.4 Corrosion or oxidation
4.19.5 Residual stress
4.19.6 Time dependent fracture

5. Fracture Surface Examination
5.1 Introduction
5.2 Fracture Mirrors, A Fractographer’s Best Friend
5.2.1 Fracture mirrors in glass
5.2.2 Fracture mirrors in ceramics
5.2.3 Fracture mirrors, special cases
5.3 Hackle
5.3.1 Coarse hackle
5.3.2 Wake hackle
5.3.3 Twist hackle
5.3.4 Other hackle
5.4 Wallner Lines
5.4.1 Introduction
5.4.2 Primary Wallner lines
5.4.3 Secondary Wallner lines
5.4.4 Tertiary Wallner lines
5.4.5 Wallner Lambda lines
5.5 Arrest Lines
5.6 Scarps
5.7 Glue Chips
5.8 Transgranular and Intergranular Fracture
5.9 Stable Crack Growth
5.9.1 Slow crack growth (SCG) at ambient temperature
5.9.2 Stable extension from local residual stress or R-curve effects
5.9.3 High temperature slow crack growth in ceramics
5.9.4 High temperature creep fracture

6. Origins of Fracture
6.1 Origins, Flaws, and Defects
6.2 The Spatial Distribution of Flaws
6.3 Are Flaws Intrinsic or Extrinsic?
6.4 Matching Fracture Halves
6.5 External Surfaces
6.6 Volume-Distributed Flaws
6.6.1 Pores
6.6.2 Porous regions
6.6.3 Porous seams
6.6.4 Agglomerates
6.6.5 Inclusions
6.6.6 Compositional inhomogeneities
6.6.7 Large grains
6.6.8 Grain boundaries
6.7 Surface-Distributed Flaws
6.8 Other Flaws
6.8.1 Processing cracks in ceramics
6.8.2 Artificial or controlled flaws, glasses and ceramics
6.8.3 Other glass origins
6.9 Fracture Oddities
6.10 Contaminants
6.11 Combined or Hybrid Flaws
6.12 Baseline Microstructure Origins
6.13 Flaw Size
6.14 Partially-Exposed Flaws
6.15 Microfault Pockets
6.16 Polished Microstructural Sections
6.17 What to Report

7. Quantitative Analysis
7.1 Introduction
7.2 Stresses from the Extent of Fragmentation
7.2.1 Annealed parts
7.2.2 Fragmentation of tempered parts
7.3 Stresses from the Branching Distances
7.3.1 Annealed plates and bars
7.3.2 Tempered plates
7.4 Stresses from the Mirror Size
7.4.1 Mirror analysis and constants
7.4.2 How to measure mirror sizes
7.5 Fracture Mechanics Analysis of the Flaw Size
7.5.1 Introduction to fracture mechanics
7.5.2 The Newman-Raju Y Factors
7.5.3 Irregularly-shaped surface cracks
7.5.4 Three-dimensional, blunt, and inclined flaws
7.6 Relationship of KIc and A
7.7 Mirror to Flaw Size Ratios
7.8 Comparing Measured to Calculated Flaw Sizes
7.9 Crack Velocities from Wallner Line Analysis
7.10 Slow Crack Growth
7.11 R- curve Behavior
7.12 Indentation Mechanics
7.13 Fractal Analysis
7.14 Estimation of Residual Stresses
7.15 Weibull Analysis

8. Single Crystals
8.1 General
8.2 Preferred Cleavage Planes
8.3 Fractographic Techniques
8.4 Fracture Surface Markings
8.5 Origins
8.6 Other Sources

9. Ceramic and Glass Composites
9.1 Particulate, Whisker, or Self-Reinforced Ceramic Composites
9.2 Fiber-Reinforced Composites

10. Case Studies
Case 1 Ruptured Rotor (Ceramic gas turbine rotor)
Case 2 Busted Barrel (Silicon carbide gun liner)
Case 3 Conflicting Carbide Data (Silicon carbide flaws and slow crack growth)
Case 4 Vulnerable Vials (Broken medicinal bottles)
Case 5 Troublesome Tubes (Sapphire in a plasma asher)
Case 6 Suffering Setter Plate (Silicon carbide furnace plate)
Case 7 Ruptured Radomes (Fused silica missile nosecones)
Case 8 Maligned Machinists (Bend bars made by different machine shops)
Case 9 Modeler’s Match (Fracture origins in MEMS scale SiC micro tensile specimens)
Case 10 Fractious Fractographers (A fractography round robin)
Case 11 Perilous Prostheses (Four ceramic dental crowns)

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