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Test Procedures for Developing Solder Data

  


by admin Filed under Electrical engineering, Electrical Science

File : pdf, 1.08 MB, 46 pages

TOC

Introduction
0.0 Materials and Processing Details
1.0 Thermal Analysis
2.0 Wetting Balance Test
3.0 Tensile Specimen Fabrication
4.0 Tensile Test Procedure
5.0 Creep Test Procedure
6.0 Metallography
7.0 Measurement of Solid State Intermetallic Compound Growth Rate (by dip method)
8.0 Measurement of Liquid-State Intermetallic Compound Growth Rate (by the hot plate method)
9.0 Fracture Toughness
10.0 Thermomechanical Fatigue Testing — Simulated Solder Joints
11.0 Thermomechanical Fatigue Test Using PWB Test Vehicles
12.0 Thermomechanical Fatigue Test Using Strips
13.0 Liquid Solder Dissolution
14.0 Acoustic Measurements of Elastic Constants
15.0 Ring-and-Plug Test
16.0 Stress-Rupture Test
17.0 Constitutive Behavior
Solder Database
Bibliography

Download     :    pdf1




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One Response to “Test Procedures for Developing Solder Data”

  1. H says:
    July 16, 2010 at 12:32 am

    GOOD WEB SITE THANKS FOR THAT

    Reply

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