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Grounding, Bounding, and Shielding for Electronic Equipment and Facilities – vol 2

  


Grounding, bonding, and shielding for electronic equipment vol 2

File : pdf, 5 MB, 394 pages

TOC

Chapt 1 NEW FACILITIES DESIGN CRITERIA
1.1 INTRODUCTION
1.2 EARTH ELECTRODE SUBSYSTEM
1.3 LIGHTNING PROTECTION FOR STRUCTURES
1.3.1 Principles of Protection
1.3.2 Integral Protection System
1.3.2.1 Air Terminals
1.3.2.2 Grounding Conductors
1.3.2.3 Fasteners
1.3.3 Separately Mounted Protection Systems
1.3.3.1 Mast Type
1.3.3.2 Overhead Ground Wire Type
1.3.3.3 Waveguide Installation and Grounding
1.3.3.4 Cable Installation and Grounding
1.3.3.5 Lightning Generated Transient Surge Protection
1.3.3.5.1 Transient Source and Equipment Damage
1.3.3.5.2 Minimizing Damage
1.3.3.5.3 Susceptible Components
1.3.3.5.4 Frequency of Transient Occurrence
1.3.3.5.5 Transient Definition, AC Service Conductors
1.3.3.5.6 Methods for Transient Protection on AC Service Conductors
1.3.3.5.7 Use of Ferrous Metal Conduit
1.3.3.5.8 Use of Overhead Guard Wires
1.3.3.5.9 Protection of Underground Cables
1.3.3.5.10 Buried Guard Wire
1.3.3.5.11 Secondary AC Surge Arrester
1.3.3.5.12 Surge Arrester Installation
1.3.3.5.14 Desirable Operating Characteristics for Transient Suppressors
1.3.3.5.15 Characteristics of Different Types of Surge Arresters
1.3.3.5.16 Transient Protection for Externally Exposed Equipment Lines
1.3.3.5.17 Frequency of Transient Occurrence
1.3.3.5.18 Amplitudes and Waveforms of Occurring Transients
1.3.3.5.19 Equipment Withstand Levels
1.3.3.5.20 Protection Methods Against Transients
1.3.3.5.21 Enclosing Cable Runs in Ferrous Metal Conduit
1.3.3.5.22 Transient Suppression
1.3.3.5.23 Types of Available Transient Suppression
1.3.3.5.24 Operating Characteristics of Transient Suppressors
1.3.3.5.25 Transient Suppressor Packaging Design
1.3.3.5.26 Coaxial Cable Shield Connection Through an Entrance Plate
1.3.3.5.27 Grounding of Unused Wires
1.3.3.5.28 Transient Suppression for RF Coaxial Lines
1.3.3.5.29 Equipment-Level Transient Suppression
1.3.3.6 Lightning Generated Transient Protection Evaluation
1.3.3.7 Transient Protection
1.3.3.7.1 Protection Requirement
1.3.3.7.2 Transient Definition
1.3.3.7.3 Determination of Equipment Damage (Withstand) Levels
1.3.3.7.4 Determination of Need for Transient Protection
1.3.3.7.5 Minimizing Transient Damage
1.3.3.7.6 AC Power Input
1.3.3.7.7 Power Supply Transient Suppression
1.3.3.7.8 Landline Transient Suppression
1.3.3.8 Corrosion Control
1.3.3.9 Joints
1.3.3.10 Physical Protection
1.4 FAULT PROTECTIVE SUBSYSTEM
1.4.1 Purpose
1.4.2 Equipment Fault Protection Subsystem Composition
1.4.3 Configuration of the Equipment Fault Protection Subsystem
1.4.4 Pipes and Tubes
1.4.5 Electrical Supporting Structures
1.4.5.1 Metal Conduit
1.4.5.2 Cable Trays
1.4.5.3 Enclosures
1.4.5.4 Cable Armor
1.4.5.5 Rotating Machinery
1.4.6 Power Distribution Systems
1.4.7 Standby AC Generators
1.4.8 Equipment Fault Protection Subsystems for Transportable Equipment
1.5 SIGNAL REFERENCE SUBSYSTEM FOR NEW FACILITIES
1.5.1 Higher Frequency Network
1.5.1.1 Multipoint Ground System
1.5.2 Lower Frequency Signal Reference Network
1.6 GROUNDING PHILOSOPHY FOR EQUIPMENTS PROCESSING NATIONAL SECURITY RELATED INFORMATION (RED/BLACK

EQUIPMENTS)
1.7 BONDING PRACTICES
1.7.1 Application Guidelines
1.7.2 Surface Preparation
1.7.3 Bond Protection Code
1.7.3.1 Jumper Fasteners
1.7.4 Typical Bonds
1.8 SHIELDING
1.9 COMMON-MODE NOISE AND INSTRUMENTATION
1.9.1 Design Practices
1.9.2 Instrumentation Considerations
1.10 EMP PROTECTION
1.10.1 Earth Connection
1.10.2 EMP Shield Applications
1.10.3 EMP Bonding Practices
1.10.4 Construction Guidelines
1.11 MILITARY MOBILE FACILITIES
1.11.1 General Tactical Grounding Requirements
1.11.1.1 Facility Ground System
1.11.1.1.1 Earth Ground
1.11.1.1.2 Power Ground
1.11.1.1.3 Lightning/EMP Protection Subsystem
1.11.1.1.4 Signal Reference Subsystem
1.11.1.1.5 Fault Protection Subsystem
1-11.1.2 Measuring Ground Resistance in Tactical Environments
1.11.1.3 Reducing Ground Resistance in Tactical Environments
1.11.1.3.1 Existing Facilities
1.11.1.3.2 Multiple Electrode System
1.11.1.3.3 Earth Electrode Subsystem
1.11.1.3.4 Chemical Treatment
1.11.2 Detailed Tactical Grounding Requirements
1.12 FENCES
1.13 INSPECTION AND TEST PROCEDURES FOR A NEW FACILITY
1.13.1 Earth Electrode Subsystem
1.13.2 Lightning Protection Network
1.13.3 Signal Reference and Fault Protection Subsystems
1.13.4 Bonds and Bonding
1.13.5 Facility Checkout Form
1.14 Part I Earth Electrode Subsystem
Part II Lightning Protection Network
Part III Facility Ground System
Part IV Bonding

CHAPT 2 – EXISTING FACILITIES
2.1 INTRODUCTION
2.2 UPGRADING
2.2.1 Drawings
2.2.2 Facility Survey
2.2.2.1 Survey Steps
2.2.2.2 Inspection Procedure
2.2.2.3 Test Procedures
2.2.2.3.1 Bond Resistance
2.2.2.3.2 Ground System Noise Current
2.2.2.3.3 Differential Noise Voltage
2.2.2.4 Survey Form
2.2.3 Guidelines for Upgrading
2.2.4 Expansion of Existing Facilities
2.2.5 Expansion of Existing Facilities for Higher-Frequency Grounds
2.3 MAINTENANCE
2.3.1 Schedules and Records
2.3.2 Maintenance Procedures
2.3.2.1 Earth Electrode Subsystem
2.3.2.2 Lightning Protection Subsystem
2.3.2.3 Bonding
2.3.2.4 Fault Protection Subsystem (Safety Ground)
2.3.2.5 Signal Reference Subsystem (Signal Grounding)
2.3.2.6 Shielding
2.3.3 Facility Maintenance Report
2.3.4 Performance Evaluation Program

2.4 GROUNDING CONSIDERATIONS FOR CLASSIFIED INFORMATION PROCESSORS (RED/BLACK EQUIPMENTS) INSTALLED PRIOR TO THIS HANDBOOK
2.4.1 Introduction
2.4.2 Existing Facilities
2.4.3 Protection Grounds
2.4.4 Signal Reference Subsystem
2.4.5 Signal Filter Ground
2.4.6 Grounding Precautions

CHAPT 3 – EQUIPMENT DESIGN CRITERIA
3.1 INTRODUCTION
3.2 GROUNDING PROCEDURES
3.2.1 Signal Grounds
3.2.1.1 Lower Frequency Equipment
3.2.1.2 Higher Frequency Equipment
3.2.1.3 Equipments Containing Both Lower and Higher Frequency Circuits
3.2.2 Fault Protection
3.2.3 Cabinet Grounding
3.3 BONDING PRACTICES
3.4 SHIELDING GUIDELINES
3.5 COMMON-MODE NOISE CONTROL AND INSTRUMENTATION GROUNDING
3.5.1 Common-Mode Noise Control
3.5.2 Instrumentation Grounding
3.5.2.1 Analog Systems
3.5.2.1.1 Grounded Transducers
3.5.2.1.2 Ungrounded Transducers
3.5.2.1.3 Amplifiers
3.5.2.2 Digital Data Systems
3.5.2.3 Recording Devices
3.6 EMP CONSIDERATIONS
3.7 EQUIPMENT INSPECTION AND TEST PROCEDURES
3.7.1 Lower Frequency Equipments
3.7.2 Higher Frequency Equipments
3.7.3 Hybrid Equipments
3.7.4 Installed Equipments
3.7.5 Fault Protection Subsystem
3.7.6 Bonding
3.7.7 Shielding
3.7.8 Instrumentation System
3.7.9 EMP Design

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2 Responses to “Grounding, Bounding, and Shielding for Electronic Equipment and Facilities – vol 2”

  1. H says:

    GOOD WEB SITE THANKS

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