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Electroplating Facilities

by @ 4:30 pm on November 19, 2009. Filed under Chemical engineering, civil engineering

File : pdf, 8.3 MB, 241 pages

TOC

Section 1 INTRODUCTION
1.1 Scope
1.2 Cancellation
1.3 Definitions
1.4 Policy
1.4.1 Guidelines
1.4.2 Standards
1.4.3 Cooperation With Review Agencies
1.4.4 Safety and Health Considerations
1.4.5 Environmental Considerations
1.4.6 Environmental Impact Statements
1.4.7 Energy Conservation
1.4.8 Water Conservation
1.4.9 Project Management
1.5 Special Provisions in Seismic Areas
1.6 Special Provisions in Seismic Areas
1.7 Purpose
1.8 Design Procedures

Section 2 ELECTROPLATING SYSTEMS
2.1 Process ing Steps
2.1.1 Design Steps
2.1.2 Design Relations
2.2 Electroplating System Design
2.2.1 System Design

Section 3 SURFACE PREPARATION
3.1. Mechanical Polishing, Buffing, and Coloring
3.1.1 Polishing and Buffing
3.2 Abrasive Blasting
3.2.1 Glass Bead Blasting
3.2.2 Abrasive Silica
3.2.3 Metallic Shot (Peening)
3.3 Decreasing
3.3.1 Decreasing Process Selection
3.3.2 Vapor Decreasing
3.3.3 Ultrasonic Decreasing
3.4 Cleaning
3.4.1 Preliminary Cleaning
3.4.1.1 Alkaline Immersion Cleaning
3.4.1.2 Emulsifiable Solvent Cleaning
3.4.1.3 Solvent Cleaning
3.4.2 Alkaline Cathodic Cleaning
3.4.3 Emulsion
3.4.6 Acid
3.4.5 Cleaning Equipment
3.5 Pickling
3.5.1 Phosphoric Acid
3.5.2 Hydrochloric Acid
3.5.3 Inhibitors
3.5.4 Equipment Used for Pickling
3.6 Descaling
3.6.1 Corrosion Resisting Steel
3.6.2.Titanium
3.7 Drying
3.8 Metallurgical Furnaces
3.8.1 Furnace Selection
3.8.2 Furnace Atmospheres
3.8.3 Furnace Design

Section 4 SPECIAL PROCESSES
4.1 Electropolishing
4.1.1 Electropolishing Processes
4.1.2 Metallurgical Requirements
4.1.3 Electropolishing Equipment
4.1.4 Electropolishing Bath Operation
4.1.5 Carbon Steel
4.1.6 Copper and its Alloys
4.1.7 Nickel and its Alloys
4.1.8 Corrosion-Resisting Steel
4.2 Passivation and Stripping
4.2.1 Passivation (Corrosion-Resisting Steel)
4.2.2 Stripping
4.3 Vapor Deposited Cadmium
4.3.1 Vapor Deposited Cadmium Process
4.3.2 Vapor Deposited Cadmium Equipment
4.3.3 General Considerations for Vapor Deposition
4.3.4 Vapor Deposited Cadmium Rack Design

Section 5 ELECTROCHEMICAL PROCESSES AND CHEMICAL TREATMENT
5.1 Metal Deposition
5.1.1 Operating Conditions
5.1.2 Bath Compositions
5.1.3 Reversible Rack – Two Bus Bar (RR-2BB) System of Hard Chromium Plating
5.1.4 Innovative Hard Chromium Plating (IHCP)
5.1.5 Selective Plating Equipment
5.1.6 Precious Metal Deposits

5.2 Chemical Treatment Processes (Including Anodizing)
5.2.1 Anodizing Aluminum (Al)
5.2.1.1 Chromic Acid Anodizing
5.2.1.2 Sulfuric Acid (Conventional) Anodizing
5.2.1.3 Hard -Coat Anodizing
5.2.2 Chromate Conversion Coatings
5.2.2.1 Zinc and Cadmium (Chromate Conversion Coatings)
5.2.2.2 Aluminum and Its Alloys (Chromate Conversion Coatings )
5.2.2.3 Copper and Its Alloys (Chromate Conversion coatings)
5.2.2.4 Magnesium and Its Alloys (Chromate Conversion Coatings)
5.2.2.5 Equipment Used in Chromate Conversion Coatings
5.2.3 Anodizing Magnesium (Mg)
5.2.4 Phosphate Conversion Coatings

Section 6 PROCESS CONTROL
6.1 Electrolyte Concentration
6.1.1 Solution Makeup
6.1.2 Agitation
6.1.3 Rinsing Techniques
6.1.4 Electrolyte Temperature Control
6.1.5 Filtration
6.2 Plating Control Instrumentation
6.2.1 Location and Design of Instruments
6.2.2 Temperature
6.2.3 Electrolyte heel
6.2.4 Electrical Power Instrumentation
6.2.5 Conductivity Meters
6.2.6 Automatic Replenishment of Baths

section 7 GENERAL EQUIPMENT
7.1 Pumps
7.1.1 Controlled Volume
7.1.2 Diaphragm
7.1.3 Centrifugal
7.2 Valves
7.2.1 Plumbing
7.3 Air Compressors
7.3.1 Air Agitators
7.3.2 Compressed Air Systems

Section 8 PLATING EQUIPMENT AND DESIGN
8.1 Racks
8.2 Handling of Items to be Plated
8.3 Electroplating and Anodizing Tanks
8.3.1 Tank Design
8.3.2 Tank Size
8.3.3 Carbon Steel
8.3.4 Corrosion-Resisting Steel
8.3.5 Lined Steel
8.3.6 Plastic

Section 9 UNIQUE ARCHITECTURAL CONSIDERATIONS
9.1 Floor Construction
9.1.1 Floor Materials
9.1.2 Housekeeping Features
9.1.3 Drains and Pipes
9.1.4 Equipment Supports and Column Pedestals
9.1.5 Stairwells
9.1.6 Brick Floor With Liner
9.1.7 Trench With Cover
9.1.8 Floor Design
9.1.9 Discharge Rates
9.1.10 Tiedovns
9.2 Distribution of Utilities
9.3 Containment of Fluids
9.3.1 Dikes and Sumps
9.3.2 Sump Design
9.3.3 Processing of Solutions
9.4 Dry Storage of Chemicals, Anodes, and Racks
9.5 Wet Scorage of Chemicals
9.6 Provisions for Racking Items to be Plated
9.7 Corrosion Resisting Material and Use of Organic
9.8 Organic Coatings
9.8.1 Plant Layout for Safety and Efficiency
9.8.2 Safe Plant Layout
9.8.3 Plant Layout for Efficiency
9.9 General Features

Section 10 POLLUTION ABATEMENT
10.1 Potential Pollution Sources
10.2 Pollution (Environmental) Control Technology
10.3 New Methods of Plating Waste Control for Electroplates
10.4 Resource Recovery Systems
10.4.1 Chemical Recovery and Reuse
10.4.2 Water Reuse
10.5 Bath Purification Systems
10.6 Ventilation/Exhaust Systems
10.7 Other Design Considerations

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2 Responses to “Electroplating Facilities”

  1. raghu says:

    we have plating shop, we need special safety procedure for plating ,& what are the safety to be required for operater

    pls let us know

  2. bambang says:

    this is an excellent book

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